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Thornton Tomasetti Announces 2019 Lee Petrella and Daniel A. Cuoco Scholarship Winners

Thornton Tomasetti Announces 2019 Lee Petrella and Daniel A. Cuoco Scholarship Winners

(New York, N.Y. – November 4, 2019) – Thornton Tomasetti has awarded two college students – Yocheved Friedman and Tsee Yung Lee – with scholarships for the 2019-20 academic year.

Lee Petrella Memorial Scholarship and Summer Internship

The 2019 Lee Petrella Memorial Scholarship and Summer Internship was awarded to Yocheved Friedman. The award provides a $5,000 scholarship and a paid internship to a civil engineering student at the City College of New York’s Grove School of Engineering.

Yocheved Friedman

Established in memory of Thornton Tomasetti Vice President Lee Petrella, the scholarship and internship provide financial assistance and professional experience to a civil engineering student who is focusing on structures at CCNY, Petrella’s alma mater. During his more than 30 years with Thornton Tomasetti, Petrella was a leader in the firm’s Structural Engineering practice and was involved in many of its signature projects, including Shanghai Tower in China, New York’s World Financial Center and Ford Field in Detroit, Michigan.

Yocheved is currently pursuing a bachelor’s degree in civil engineering, with an emphasis on structures, at City College of New York. She interned with Thornton Tomasetti’s Structural Engineering practice in its New York, Madison Avenue office this past summer.

“I am honored to have been given the opportunity to learn from Thornton Tomasetti’s brilliant structural engineering team,” said Yocheved Friedman. “During my internship, I was introduced to new ideas and concepts that will help me throughout my career.”

Tsee Yung Lee

Daniel A. Cuoco Endowed Memorial Scholarship

Tsee Yung Lee is the 2019 recipient of the Daniel A. Cuoco Endowed Memorial Scholarship. The scholarship provides $5,000 annually to a structural engineering student at City College of New York’s Grove School of Engineering in Manhattan.

This scholarship fund was established in 2015 by Thornton Tomasetti in memory of former President and CEO Daniel Cuoco whose career with the firm spanned 40 years. He was an active participant in the company’s growth from a 15-person, single-office firm to one that now employs more than 1,500 people in offices around the globe. Cuoco, a CCNY graduate, helped establish Thornton Tomasetti as a world leader in structural design and forensics and was an early adopter of emerging technologies, such as building information modeling. In addition to serving as a role model, he was an active mentor to young engineers.

Tsee is currently studying civil engineering at CCNY. He is on track to receive a bachelor’s degree in May 2021.

“I am grateful to everyone at Grove School of Engineering and Thornton Tomasetti for the opportunities that this scholarship provides,” noted Tsee Yung Lee. “It is an honor to be recognized for my achievements. I am inspired to do my best work academically, and one day I hope to help other students, just like you helped me.”

Executive Quote

Thomas Scarangello, P.E., Chairman and CEO, Thornton Tomasetti
“As we celebrate the exceptional lives of Daniel Cuoco and Lee Petrella, we are reminded of the passion and dedication it takes to succeed in this industry. Yocheved and Tsee clearly demonstrate these qualities, and we are pleased to support their educational and career goals. We are confident we will be hearing more about them in future.”

Supporting Materials
Thornton Tomasetti

About Thornton Tomasetti

Thornton Tomasetti optimizes the design and performance of structures, materials and systems for projects of every size and level of complexity. An employee-owned organization of engineers, scientists, architects and other professionals collaborating from offices worldwide, we support clients by drawing on the diverse expertise of our integrated practices. We are committed to be a sustainable and enduring organization and the global driver of innovation in our industry.

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